MCLR(MOBILE CHIP LEVEL REPAIR)
Learn Micro-Soldering & Tool Calibration
Master Underfill Removal & IC Desoldering
Learn Professional BGA Reballing techniques (Manual & Stencil)
Use power IC (PMIC) & UNderstand Charging IC Diagnostics
Techniques for Glass IC & Sensitive Componenet Handling
Master Advanced Jumpering & Trace Repair
Final Assembly, Testing & QA
MCLR (Mobile Chip Level Repair) is a 7-day intensive short-term training course in Nairobi, Kenya, designed for learners aiming to master advanced mobile phone chip-level repair techniques. This hands-on training program covers micro-soldering and tool calibration, professional BGA reballing (manual and stencil), underfill removal and IC desoldering, as well as power IC (PMIC) and charging IC diagnostics. Students also gain practical expertise in glass IC and sensitive component handling, advanced jumpering, trace repair, and final device assembly, testing, and quality assurance. By the end of this advanced mobile chip-level repair training at our training institute, learners will have the technical mastery and job-ready skills required to perform high-end mobile repairs and excel in Nairobi’s growing mobile electronics repair industry.
Course Details
Duration: 7-Day intensive Training
Schedule: 3 Hours Per Day
Mode of Study: 100% Physical Attendance (Hands-On Practical Lab Training)
Level: intensive short- term Training